Pay in installments of $3.57 with
,
and
Shipping Estimate
USA
- USA
- CAN
- USA
- CAN
Ships within 48 hours · Estimated delivery Jul 21 - Jul 26
Promo Codes Available:
For Your Every Summer RSVP, with Code: SUMMER15
Description
Silicon dioxide NanopowderProduct Name Silicon dioxide Nanopowder Product Overview The basic structure of nanosilica is SiO2 in the form of an amorphous white powder, and the microstructure can be spherical, flocculent or reticulated with a quasi particulate structure. The presence of unsaturated residual bonds and hydroxyl groups in different bonding states on its surface are properties that make it excel in various applications. There are three main methods for the
Product Name
Silicon dioxide Nanopowder
Product Overview
The basic structure of nanosilica is SiO2 in the form of an amorphous white powder, and the microstructure can be spherical, flocculent or reticulated with a quasi-particulate structure. The presence of unsaturated residual bonds and hydroxyl groups in different bonding states on its surface are properties that make it excel in various applications. There are three main methods for the preparation of nanosilica, which include: Precipitation: nanosilica is produced by high temperature hydrolysis of silicon halides in a hydroxide flame. Sol-gel method: silanol salts are used as precursors, hydrolysed and condensed in a solvent to form sols and gels, which are then dried and calcined to obtain nanosilica. Fumed-phase method: nanosilica is generated by high-temperature hydrolysis of silicon halides in a hydroxide flame.
Technical Parameter
Appearance：White powder
BET:45-160 m2/g
Purity:9%
Particle:0 nm
Product Features
High Specific Surface Area: Due to its small particle size, nanosilica has a very high specific surface area, which provides it with more active sites.
Reflectivity: It is effective in reflecting UV, visible and infrared light, making it useful in many applications where UV protection is required.
Biocompatibility: Silica nanoparticles are biocompatible and can be used in biomedical applications.
Application Fields
Electronic encapsulation materials: widely used in electronic and electrical industries due to its high dielectric, heat resistance and high filling capacity.
Rubber modification: to improve the tensile strength, tear resistance and abrasion resistance of rubber products, significantly improving the performance of rubber.
Coatings and adhesives: used to improve the rheology and thixotropy of coatings and adhesives, enhance their anti-settling and thickening effects.
Optoelectronics: widely used in optical sensors, solar cells, display technology, etc., such as dye-sensitised solar cells for photoelectric conversion efficiency enhancement.
Related Information
Sealed, avoid light, and keep at normal temperature. Expiry date: Twelve months before unsealing.
Please e-mail for the detailed characterization data.
E-mail:[email protected]
Shipping Notes
- Free Standard Shipping on $100+ Orders to the USA.
- Except Preorder products are shipped in 48 hours.
- Delivery to the USA:
- Standard Shipping : 3-10 business days
- If time is of the essence, please consider selecting expedited delivery for faster service.
Exchange/Return Notes
- We offer a 30-day return/exchange service after receiving.
- Final sale items are not eligible for returns or exchanges.
- To process your return/exchange, please contact us at [email protected]
- Please click here for more details>>> Return & Exchange Policy