AKASA AK-T565-5G T5 Pro-Grade+ Thermal Compound Syringe, 5g, Grey, Ultra-Performance with Hybrid Silicone & Nano-Diamond Particles, Non-Curing, Non-Electrically Conductive, Includes Spreader & Cleaning Wipes

AKASA AK-T565-5G T5 Pro-Grade+ Thermal Compound Syringe, 5g, Grey, Ultra-Performance with Hybrid Silicone & Nano-Diamond Particles, Non-Curing, Non-Electrically Conductive, Includes Spreader & Cleaning WipesT5 Pro Grade+ Easily apply ultra performance hybrid thermal paste to your CPU and GPU, designed for highly efficient computer setups. Perfect for overclocking enthusiasts with 10 20 applications. Designed with hybrid silicone and nano diamond particles for ultra performance Non curing and non electrically conductive properties Conveniently included wipes and spreader Nano Diamond Particles for Superior Heat Transmission Use of hybrid silicone and nano

T5 Pro-Grade+
Easily apply ultra-performance hybrid thermal paste to your CPU and GPU, designed for highly efficient computer setups. Perfect for overclocking enthusiasts with 10-20 applications.
- Designed with hybrid silicone and nano-diamond particles for ultra-performance
- Non-curing and non-electrically conductive properties
- Conveniently included wipes and spreader

Nano-Diamond Particles for Superior Heat Transmission
Use of hybrid silicone and nano diamond micro particles ensures minimal thermal resistance for quick and efficient heat transmission.
Getting the most out of your processor, air and liquid heatsink cooler. Making it perfect for overclockers.

Easy and Safe Application
Non-curing paste means no time required to wait for curing process reaching its highest performance right from the get-go. Non-conductive properties ensures that there is no electrical risk with components.

Conveniently Included Wipes and Spreader
Easy application with included spreader to get an even coating on CPU or GPU for best efficiency. Wipes also included to clean old paste to make sure a good bond is established with heatsink.

Application
Thermally conductive compound

Thermal Conductivity
5.2 W/mK

Specific Gravity
2.6

Form
Non-curing compound

Operating Temperature
-50°C to 250°C

Thermal Resistance
0.04°C-cm²/W @ 60 psi

Colour
Grey

Viscosity
6,000,000 (mPa.s/ 22°C)

Weight
5g